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New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors

机译：考虑设计因素相互作用的BGa封装焊点可靠性评估新方法

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Satoshi Kondo; Qiang Yu; Tadahiro Shibutani; Masaki Shiratori;
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年度 2008
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1. The Assessment of Influence of the Design Factors on the Reliability of BGA Solder Joints [J] . Jae Chul JIN, Qiang Yu, Tadahiro Shibutani, Key Engineering Materials . 2005,第Pt3期

机译：设计因素对BGA焊点可靠性的影响评估
2. QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA)ASSEMBLY--PART Ⅱ: RELIABILITY EXPERIMENT AND NUMERICAL SIMULATION [J] . 史训清, John HL Pang, 杨前进, 力学学报：英文版 . 2002,第004期

机译：球栅阵列（BGA）组装中焊点可靠性的快速评估方法-第二部分：可靠性实验与数值模拟
3. QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA) ASSEMBLY——PART Ⅰ: CREEP CONSTITUTIVE RELATION AND FATIGUE MODEL [J] . 史训清, 王志平, John HL Pang, 力学学报：英文版 . 2002,第003期

机译：球栅阵列（BGA）组件中焊点可靠性的快速评估方法-第一部分：蠕变本构关系和疲劳模型
4. New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors [C] . Satoshi KONDO, Qiang YU, Tadahiro SHIBUTANI, International Workshop on Thermal Investigation of ICs and Systems . 2008

机译：通过考虑设计因子之间的相互作用，BGA包装中焊接接头的新可靠性评估方法
5. Reliability Assessment of Solder Joint Using BGA Package: Megtron 6 Versus FR4 Printed Circuit Boards Using Drop Testing [D] . Mundhe, Pradnya 2017

机译：使用BGA封装的焊点可靠性评估：Megtron 6与FR4印刷电路板的跌落测试
6. Reliability Study of Solder Paste Alloy for the Improvement of Solder Joint at Surface Mount Fine-Pitch Components [O] . Mohd Nizam Ab. Rahman, Noor Suhana Mohd Zubir, Raden Achmad Chairdino Leuveano, 2014

机译：锡膏合金的可靠性研究以改善表面安装细间距元件的焊点
7. New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors [O] . Kondo, Satoshi, Yu, Qiang, Shibutani, T., 2008

机译：基于maTLaB的BGa封装焊点可靠性评估新方法考虑设计因素之间的相互作用

New Reliability Assessment Method for Solder Joints in BGA Package by Considering the Interaction between Design Factors

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